The conventional PCBs have electrical connection on the normal FR-4 material through the vias. After a long-term development, it has evolved from single-layer to double-layer, multi-layer PCBs.

MPCB, a metal-based PCB, is comprised of a metal substrate (ie Aluminum, Copper or Stainless Steel ect.,), thermal dissipating dielectric and the copper circuit.

HDI, High Density Interconnect, with microvia≤0.15mm， use fine feature technology to connect components in small packages.

Electronic products such as smartphones, tablets and wearable devices are becoming increasingly intelligent, thin and functional.

Flexible printed circuit boards (FPC) has become a common component of electronic products due to its lightness and flexibility performance.

Rigid-flex boards are PCBs that have Flexible PCBs (FPC) and Rigid PCBs on the same board, which are commonly employed to save space, remove wiring

High layer count PCBs, widely found in file servers, data storage, GPS technology, satellite systems, weather analysis and medical equipment are usually ≥12L with special performance requirement raw material.