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HDI PCBs

HDI, High Density Interconnect, with microvia≤0.15mm， use fine feature technology to connect components in small packages.

HDI PCB

HDI, High Density Interconnect, with microvia≤0.15mm， use fine feature technology to connect components in small packages. HDI’s smaller geometry allows for higher wiring density. The electrical performance is greatly improved because of control on lower parasitic, minimal stubs, removal of decoupling capacitors and lower crosstalk. RFI and EMI is much lower due to ground planes being closer together, distributed capacitance is closer.

KINWONG CAPABILITIES ARE AS FOLLOWS:

43556636545a5a3431336575306a5759464c4c6c56773d3d.png Increasing the wiring density

43556636545a5a3431336575306a5759464c4c6c56773d3d.png Facilitates the use of advanced packaging technology

43556636545a5a3431336575306a5759464c4c6c56773d3d.png Can improve radio frequency interference / electromagnetic wave interference / electrostatic discharge (RFI/EMI/ESD)

43556636545a5a3431336575306a5759464c4c6c56773d3d.png Any-layer (2021, Zhuhai)

43556636545a5a3431336575306a5759464c4c6c56773d3d.png mSAP (2023, Zhuhai)

43556636545a5a3431336575306a5759464c4c6c56773d3d.png Advanced equipment

43556636545a5a3431336575306a5759464c4c6c56773d3d.png Min. trace width/spacing: 0.04mm/0.04mm (2021, Zhuhai)

43556636545a5a3431336575306a5759464c4c6c56773d3d.png Max. solder mask registration tolerance+/-1mil


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